PCB Capabilities

Twisted Traces provides high-quality quick turn PCB fabrication services in the US. We understand the importance of shortening lead times and hence make it a point to deliver our products and services within the stipulated timeframe. Over the years, we have developed various innovative techniques, which help us assure the fastest turnaround times. Our deadline-centric approach has also won us several satisfied clients, who acknowledged that they could launch their products much faster than expected.

Being a leading PCB manufacturer, we have developed various capabilities. These capabilities have helped us fulfill any complex fabrication task efficiently. We have provided full prototype PCBs for various small and large businesses in the US. We can take up minimum 1 order to maximum 5,000 full production prototype orders.

All our PCBs are made in USA at our Elk Grove Village, IL facility. We follow industry-leading procedures, and have a team of experts who never fail to amaze our clients.

Do you need a high-quality printed circuit board urgently? Get a custom quote today.

Learn about Twisted Traces' PCB manufacturing capabilities which help us design and build PCBs as per your needs. Below is a summary of our pcb manufacturing capabilities for your understanding. Here, you can build and order PCBs online. . You can send us your file in the Gerber 24x7 format. For an easy download, it is recommended to send zipped files, and in the Readme format.

Item Description
Layer 1– 20 Layers (FR-4, FR-406, 370 HR)
1– 2 Layers (Rogers, Aluminum/copper base, Teflon)
Material FR- 4, FR- 406, 370 HR; Rogers4003; Rogers4350
Aluminum and copper base;Teflon
Finish Thickness Finish thickness: 0.008" - 0.275" (0.2 mm- 7 mm)
Min Thickness 2-layer: 0.008" (0.2 mm)
4-layer: 0.016" (0.4 mm)
6-layer: 0.024" (0.6 mm)
8-layer: 0.032" (0.8 mm)
10-layer: 0.04”(1 mm)
More than 10 layers (0.5 X number of layers X 0.008”)
Surface Finishing Lead Finishing: HASL, HASL+Gold finger
Lead- free Finishing: Lead- free HASL, ENG Gold, OSP, Immersion silver
Special Process Impedance board (request as± 10%)
High TG/halogen- free/halogen- free & High TG board
Max / Min Board Size 1–2 Layers: Max : 59" x 50"/Min: 0.2" x 0.2"
4–6 Layers: Max : 32" x 28"/Min: 0.4" x 0.4"
8 Layers: Max : 30" x 24"/Min: 0.4" x 0.4"
Min Trace
Width / Min Clearance
Inner Layers(trace width/clearance)
0.5 oz: 4/4 mil
1 oz: 5/5 mil
2 oz: 5/7 mil
3 oz: 7/8 mil
4 oz: 10/10 mil
5 oz 12/12 mil
6 oz/ 15/12 mil
Outer Layers(trace width/clearance)
1/ 3 oz- Hoz: 4/ 4 mil
1 oz: 5/5 mil
2 oz: 5/7 mil
3 oz: 7/8 mil
4 oz: 10/10 mil
5 oz: 12/12 mil
6 oz: 15/12 mil
Aspect Ratio
10 : 1
Board thickness Min hole size
8 mil – 62 mil 6 mil
80 mil 8 mil
93 mil 9 mil
125 mil 12 mil
Silk Screen Color White, Black
Min Hole Ring
Inner:
0.5 oz: 5 mil
1 oz: 6 mil
2 oz: 8 mil
3 oz: 12 mil
4 oz: 15 mil
5 oz: 18 mil
6oz: 20 mil
Outer:
1/ 3 oz -0.5oz: 4 mil
1 oz: 5 mil
2 oz: 7 mil
3 oz: 10 mil
4 oz: 16 mil
5 oz: 18 mil
6 oz: 20 mil
Copper Thickness Inner: H0.5 oz, 1 oz, 2 oz, 3 oz, 4 oz, 5 oz, 6 oz
Outer: 1/3 oz, 0.5 oz, 1 oz, 2 oz, 3oz, 4 oz, 5 oz, 6oz
Min Hole Size and Tolerance Min finish hole: 6 mil
Hole tolerance: ±3 mil
Thickness of Plating Layer
HASL:
Copper Thickness: 20 um - 35 um Tin : 5 - 20 um
Immersion Gold:
Nickel 100u" -200 u" Gold : 2u" -4u"
Hard Plated Gold:
Nickel 100u" -200 u" Gold : 4u" -8u"
Golden Finger:
Nickel : 100u" -200 u" Gold : 5u" -15u"
Immersion Silver: 6u" -12u"
OSP: Film 8u" -20u"
Solder Mask Color
Glossy: Green, Black, Red, Yellow, White, Purple, Blue
Matt: Green, Black
Solder Mask Resolution
Solder Mask Thickness: 0.2 mil -1.6 mil
Solder Dam: Green 7 mil /Other Color 8 mil
Solder Mask Hole Plug Diameter: 10 mil -25 mil
Profile
Punch Tol: ± 5 mil
CNC Tol: ± 5 mil
V- CUT Tol: ± 10 mil
Bevel Edge: ± 5 mil
Slot Min: 32 mil
Slot Min: 32 mil
Angel: 15°, 20°, 30°, 45°, 60°
Bow and Twist SMT≤ 0.75%
None SMT ≤ 1%
Accepted Standards IPC Class 2; IPC Class 3; ISO9000

Step-By-Step Process to Manufacture a PCB

1. Pre Production Engineering

2. Prepare the phototools

3. Print inner layers

4. Etch inner layers

5. Electroless copper deposition

6. Image the outer layers

7. Lay-up and bond

8. Automatic Optical Inspection

9. Outer layer AOI

10. Etch outer layer

11. Plating

12. Drill the PCB

13. Soldermask

14. Surface finish

15. Profile 


Customer Evaluation