Ball Grid Array (BGA) – Introduction, Packaging Technologies, Advantages, and Applications Discussed

Ball Grid Array
Ball Grid Array (BGA) – Introduction, Packaging Technologies, Advantages, and Applications Discussed

Over the last few years, the demand for compact printed circuit boards with complex circuits has increased. This is mainly because of the demand for small-sized handheld devices with multiple functionalities. Printed circuit boards (PCBs) are the core of electronic and electromechanical devices today. The functionality of these devices highly depends on the accuracy of these boards. Thus, all the stages in making these boards, such as designing, manufacturing, and assembling are of equal importance. Accurate component mounting and wiring are crucial steps and surface mount technology is commonly used for permanent and precise mounting. Ball Grid Array (BGA) packages worked as chip carriers and used to mount devices on the board. BGA is employed for PCBs demanding high-density connections. Is that all? Would you like to know more about this technology? If yes, then this post discusses the details about BGA. So, stay tuned.

Get Introduced to Ball Grid Array (BGA) 

BGA is the most popular surface-mount device used for integrated circuits. The technology uses a large number of solder balls to make electrical interconnections, achieved between the package base and the body. This surface mount technology is well-known for its flexibility. Different BGA components have been developed based on the variety of packaging materials. Some of them are Tape BGA (TBGA), Plastic BGA (PBGA), Ceramic BGA (CBGA), Ceramic Column (CCBGA), and more. These components are briefly described in the following section. They offer many benefits such as great electrical and frequency characteristics, reduced soldering defects, higher packaging reliability, assured BGA soldering planarity, and more.

Different BGA Packaging Technology Explained

This section discusses the aforementioned BGA packages in detail.

  • Micro BGA(MBGA): This type of BGA package is smaller than the regular ones. This allows the PCB assembler to develop advanced yet compact-sized products. Micro BGAs are mainly available in three pitches: 0.75mm, 0.65mm, and 0.8mm.
  • Tape BGA (TBGA): This BGA package is designed for mid to high-end electronic solutions demanding high thermal performance without an external heat sink.
  • Plastic BGA (PBGA): This BGA package is best suited for mid to high-performance devices that need low inductance, ease of surface mounting, and are of relatively low costs. Plastic BGA or PBGA has additional copper layers, increasing power dissipation.
  • Fine BGA (FBGA): FBGA is mainly used in system-on-a-chip contacts. This package has extremely thin contacts.
  • Thermally Enhanced Plastic BGA (TEPBGA): This package offers excellent heat dissipation. The substrate has thick copper planes, which draw heat from the circuit board.
  • Molded Array Process BGA (MAPBGA): This BGA package is ideal for an electronic solution with low inductance packaging. MAPGA offers high reliability and is also an affordable option available today.

Why Use Ball Grid Array for PCB Assembly?

BGA assembly offers several benefits over other technologies. The following benefits contribute to their popularity and explain why this technology is preferred across industries.

  • One of the most significant advantages of this technology is that it reduces the package's thickness. This allows engineers to make thinner circuit board assemblies.
  • With low pins, BGA packages help improve the electrical and thermal performance of the circuit boards.
  • The probability of circuit board damage is reduced significantly with the use of solid solder balls.
  • BGA makes use of bigger pad sizes, which enhances re-workability.
  • This technology improves soldering to a large extent. Aside from this, it helps achieve comfortable and wide spacing between electrical connections.

Industrial Applications of BGA Assembly Boards

Owing to all of these benefits, this technology finds extensive application in a wide range of industrial segments. Here are some of the application areas.
  • Mobile phones,
  • Consumer electronics such as TV
  • Automotive
  • Military systems and equipment 

Are you looking for a BGA assembly service provider in the USA? You will find many that offer high-quality services at the most competitive prices. However, there are very few that have achieved great success. Twisted Traces is one among them. With years of market presence and skilled employees, the company specializes in designing and building BGA assemblies for several electronics applications and is counted as prominent among its other competitors. 

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